JPH0737321Y2 - 表面実装用半導体装置 - Google Patents
表面実装用半導体装置Info
- Publication number
- JPH0737321Y2 JPH0737321Y2 JP1988120561U JP12056188U JPH0737321Y2 JP H0737321 Y2 JPH0737321 Y2 JP H0737321Y2 JP 1988120561 U JP1988120561 U JP 1988120561U JP 12056188 U JP12056188 U JP 12056188U JP H0737321 Y2 JPH0737321 Y2 JP H0737321Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead
- soldering
- solder
- surface mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988120561U JPH0737321Y2 (ja) | 1988-09-14 | 1988-09-14 | 表面実装用半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988120561U JPH0737321Y2 (ja) | 1988-09-14 | 1988-09-14 | 表面実装用半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0241454U JPH0241454U (en]) | 1990-03-22 |
JPH0737321Y2 true JPH0737321Y2 (ja) | 1995-08-23 |
Family
ID=31366782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988120561U Expired - Lifetime JPH0737321Y2 (ja) | 1988-09-14 | 1988-09-14 | 表面実装用半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0737321Y2 (en]) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61214546A (ja) * | 1985-03-20 | 1986-09-24 | Hitachi Tobu Semiconductor Ltd | リ−ド切断成型装置 |
JPS62171148A (ja) * | 1986-01-23 | 1987-07-28 | Oki Electric Ind Co Ltd | チツプキヤリア型icの製造方法 |
-
1988
- 1988-09-14 JP JP1988120561U patent/JPH0737321Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0241454U (en]) | 1990-03-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0737321Y2 (ja) | 表面実装用半導体装置 | |
US5406458A (en) | Printed circuit board having tapered contact pads for surface mounted electrical components | |
JP2000261131A (ja) | 分割フットパターン | |
JPS6342416B2 (en]) | ||
JPH04237155A (ja) | 電子部品 | |
JP2523512Y2 (ja) | フラットパッケ−ジ型ic | |
JPH0625017Y2 (ja) | Lsiパッケ−ジのリ−ド構造 | |
JPH0157991B2 (en]) | ||
JPH03298Y2 (en]) | ||
JPS6023998Y2 (ja) | 加熱用圧着子 | |
JPH04171855A (ja) | 半導体装置用リードフレーム | |
JPH0550141B2 (en]) | ||
JP2991174B2 (ja) | 半導体装置用リードフレームおよびその半導体装置の製造方法 | |
JPS6225900Y2 (en]) | ||
JPH0195589A (ja) | リードレス部品の取付構造 | |
JPH02150052A (ja) | 集積回路用フラットパッケージ | |
JP2002239719A (ja) | はんだこて | |
JPH03220792A (ja) | Pga型集積回路の実装構造 | |
JPH0215316Y2 (en]) | ||
JPH0817983A (ja) | 半田めっき装置 | |
JPH0577948U (ja) | 表面実装部品のリード構造 | |
JPH0349397Y2 (en]) | ||
JPH04206597A (ja) | プリント配線基板 | |
JPH02241084A (ja) | 電子部品装着方法 | |
JPH0274097A (ja) | 電子部品のリード端子の半田付け方法 |